Goot Desoldering Wick

Goot Desoldering Wick

£1.99

Description

Goot Desoldering Wick

De-soldering braid packaged in static bobbin, three sizes available and best on market

Significantly reduces rework/repair time
Minimises the risk of damage to the board
BGA desolder braid is designed for removing solder from BGA pads and chips

 

Additional information

Weight 0.1 kg
Dimensions 10 × 10 × 2 cm
Size

1.5mm, 2.0mm, 2.5mm

Brand

TestClips

test clips

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